Plasma Etch System
Chamber Construction :
- All internal surfaces are electro polished 304 stainless steel
Features :
- Parallel plate reactor type
- Z axis electrical movement 50 mm
- Substrate 100? electrical heating
- Maximum 6” wafer or small sample
- PID pressure control
- Automated process operation
- 600 watt 13.56Mhz generator
- 5×10-6 Torr Ultimate vacuum
Option :
- Load lock option only
- Gas scrubber for process gases evolved
- Chamber Wall heating
Applications :
- Stripping or ashing
- Dry etching