PVD Deposition Systems

RF & DC Sputtering System

RF & DC Sputtering System

Scientific & Analytical Instruments offers standard and customized RF/DC Magnetron Sputtering System in different size as per customer requirement to produce quality, thin and homogenous film coatings. SAI Sputtering systems are versatile for thin film coatings in Research, Educational Institutions, Semiconductor, Optics and Material Science Research.

Basic Features of RF/DC Sputtering Systems:

Dimensions: Standard Size 12" 15" and 18". Custom Size also available

Chamber: Stainless Steel with Cooling channels. All the inner walls are polished to achieve low degassing rates and reach better ultimate vacuum and fitted with Viton "O" rings.
Suitable thickness SS liners are provided inside the chamber on all surfaces to prevent the coating on the chamber surface by evaporating material. Vacuum Chamber is provided with 2-3 Nos. view Ports for monitoring of process. The chamber is Helium Leak Tested using Helium Leak Detector to an individual leak rate of 1 x 10-9 m.bar ltrs/sec.

RF & DC Sputtering System

Pumping System: Oil Rotary Pump, Diffusion Pump, Roughing & Backing Valve, Butterfly Valve, Liquid Nitrogen Trap, Pirani & Penning Guages to measure Vacuum upto 10-6 mbar vacuum. With Turbo Molecular Pump and Cryo Pump, Ultimate Vacuum can be achieved in the range of 10-7 mbar.

Optional: Dry Pump ( Diaphragm Pump ), Turbo Molecular Pumps and Cryo Pumps

Magnetron: 1 No. 2" size Magnetron as Standard. 4 Nos. Magnetron of different size with Confocal geometry can also be provided on request.

Magnetron Orientation: As a standard Downward Sputtering. We can provide Up Sputtering and Con-focal Magnetron Orientation as per customer request can be provided.

Glow Discharge: HT Glow Discharge for cleaning is provided.

Sputtering Power Supply: As a standard 2Kw DC Power supply and 300W RF Power Supply with Matching Network. RF or DC or Pulsed DC or combination of either of RF or DC or Pulsed DC of any rating as per Customer request can be provided.

RF & DC Sputtering System

Target Holder: Target Holder with Water Cooling arrangement is provided as per Substrate size.

Shutters: Shutters are provided to cover Substrate and Magnetron Target Holders.

Safety Devices: Water flow Switch, LT & HT control switch, Electrical Load switch, DP Heater protection switch.

Control System: As a standard Manual. PLC and SCADA based to store recipe of Evaporation Cycle and automatic control of system.

Aesthetics: Compact and Elegant, Easy to Service and Cabinet Mounted for maneuverability.

Optional Features:

Substrate Rotation, Digital Thickness Monitor and Gas Flow Control with Mass Flow Controller.

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